Our client was one of the top 5 interconnect companies in the world prior to its acquisition. Their products typically employed leading edge technology and the company introduced products on extremely aggressive schedules. Their core competency in interconnect development was unsurpassed. However, in certain instances, their internal resources became overtaxed.
IST was able to fill that void. We were contracted to work with their design team to develop a board-to-board power connector with an electrical rating of 250 VAC and 30 Amps peek @ 70 degrees centigrade. This module had to be designed in such a manner as to allow the device to be used as a stand-alone unit or as stacked multiple units. The power module’s form factor and profile had to fall within that of an existing low voltage signal module. This would allow either module type to be mounted side-by-side on a printed circuit board.
Because of our intimate knowledge and expertise of the electronic interconnects industry, we were able to develop a product that met their size and performance criteria. We also recommended and incorporated a mechanically staggered ground and voltage engagement sequence which allowed the device to be plugged and un-plugged while system power was on. This is a typical occurrence in the telecom industry and is know as Hot Swapping. IST also participated in the manufacture and testing of prototype units to validate the design intent.
ist gets it done!