CASE STUDIES — High Density Board-to-Board Interconnect Device

Our client is one of the fastest growing start-up companies in Silicon Valley. They operate on the leading edge of the technology envelope on extremely aggressive projects and schedules. Their core competency in semiconductor technologies and packaging techniques is unsurpassed. However, their expertise in high speed, continuous injection and insert molding processes was challenged.

IST was able to fill that void. We were contracted to work with their development team to integrate the necessary design criteria which would marry the products design intent with the required manufacturing processes. Because of our intimate knowledge and expertise of the electronic interconnects industry, we were able to develop a series of product enhancements for their product which increased signal density, provided advanced signal terminations, offered RFI and EMI shielding, included discrete power contacts, and introduced a conductive guide mechanism which also provided ESD protection.

Technical Skills

  • Intimate knowledge of industry, equipment, and application engineering
  • Transmission Line and Signal Fidelity Theory
  • Electronic Contact Physics
  • Electro-mechanical engineering principles
  • Copper Alloy materials selection
  • Polyester Thermoplastic materials selection
  • Injection Molding manufacturing processes
  • Materials Treatments and Finishes
  • Technical Writing & Report Generation

ist gets it done!