CASE STUDIES — High Speed Optical Transceiver Board Connector

Our customer is one of the top 3 interconnect companies in the world. Their products typically employ leading edge technology and the company introduces products on extremely aggressive schedules. Their core competency in interconnect development is unsurpassed. However, their ability to bring this project in on time was hindered by a lack of available internal resources.

IST was able to fill that void. We were contracted to develop the SFP/XFP connector systems which complied with an industry standard Multi-source Agreement, (MSA).

Because of our intimate knowledge and expertise of the electronic interconnects industry, we were able to develop a connector that met the MSA performance criteria. This product was designed to meet the requirements of various telecom protocols which included Asynchronous Transfer Mode (ATM), FDDI, Fibre Channel, Fast Ethernet, Gigabit Ethernet, and Synchronous Optical Network (SONET) / Synchronous Digital Hierarchy (SDH) applications. The SFP connector was developed to operate at transmission rates up to 5.0 Gb/s operating over multimode and single mode fiber while the XFP connector included geometry and material enhancements which permitted its operation at transmission rates up to 10.0 Gb/s over the same medium.

Technical Skills

  • Intimate knowledge of industry, equipment, and application engineering
  • Transmission Line and Signal Fidelity Theory
  • Electronic Contact Physics
  • Electro-mechanical engineering principles
  • Copper Alloy materials selection
  • Polyester Thermoplastic materials selection
  • Injection Molding manufacturing processes
  • Materials Treatments and Finishes

ist gets it done!