Our client is one of the largest interconnect manufacturing companies in the northeast. They operate on the leading edge of the technology envelope on extremely aggressive projects and schedules. Their core competency in board-to-board high density connectors and solder ball technologies is unsurpassed. However, their expertise in the area of high speed transmission line theory, signal fidelity, and the telecom industry performance criteria was challenged.
IST was able to fill that void. We were contracted to lead the development of a new product specifically targeted at telecom equipment manufacturers. These new interconnects had to posses a matched impedance signal path throughout the connectors mated contacts. A basic design goal established by our customer required that these interconnects exhibit an initial impedance level of 50 Ohms single-ended, and 100 Ohms differential.
To accomplish this, we had to develop and incorporate integral grounding and isolation mechanisms into the connectors geometry and afford particular attention to stub termination characteristics to minimize ground looping. We also developed an integral RFI and EMI shielding component to enhance system performance and comply with FCC Part B requirements. To ensure the connectors electrical performance attributes were met, we judiciously balanced the conductive and isolative geometries in a manner that would preserve signal fidelity while greatly minimizing the adverse effects of inductive and capacitive loading. IST was also responsible to provide the electronic characterization modeling and simulation on this project.
ist gets it done!